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    Leak Specifications Chip Snapdragon 670

    After launching the Snapdragon 845 system on-chip (SoC) last December, Qualcomm is rumored to be about to introduce the middle-chip chip product Snapdrago 670 at the Mobile World Congress 2018, later this month.

    Specifications of Snapdragon 670 chip or also known as “SDM670” began circulating at the end of 2017. Later, other rumors confirmed the innards kitchen contents of the mid-range smartphone runway.

    Aimed at as Snapdragon 660’s successor, the Snapdragon 670 chip is supposedly a cheaper version of Snapdragon 845 with some specs trimmed.

    Instead of using an octa-core configuration with four high-speed CPUs and four power-saving CPUs, Qualcomm is expected to use a hexa-core cluster containing four power-saving cores and two high-speed cores in Snapdragon 670.

    The four power-saving CPU cores used are named Kyro 300 Silver and none other than the adaptation of Cortex-A55 core made by ARM with a working frequency of 1.7 GHz.

    Meanwhile, two high-speed CPU cores in Snapdragon 670 named Kyro 300 Gold and is an ARM Cortex-A75 looking 2.6 GHz tuning core adapter.

    By comparison, the four core CPUs of Kyro 385 on the high-end Snapdragon 845 chip have a frequency of 2.8 GHz.

    For graphics processor (GPU), Snapdragon 670 is allegedly using Adreno 615 which supports high resolution camera in dual-camera configuration. Whereas, the screen resolution is supported up to WQHD (2,560 x 1,400 pixels).

    Other specifications of Snapdragon 670 include UFS 2.1 flash memory support and eMMC 5.1, level 1 32KB cache for each CPU core, level 2 cache 128 KB per cluster, and level 3 cache 1024 KB for the entire SoC.

    After its introduction at the 2018 MWC event, Snapdragon 670-powered phones are expected to start coming in the market in the next few months.

    Source: Gizmochina

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